Electron accumulation-type Ohmic contact for MoS2 field-effect transistor

The formation of an Ohmic contact at a metal/two-dimensional (2D) semiconductor interface is a critical step for the future development of high-performance and energy-efficient electronic and optoelectronic applications based on semiconducting transition-metal dichalcogenides. The deposition process of metals at high thermal energy introduces crystalline defects in 2D semiconducting layers, leading to an uncontrollable Schottky barrier height regardless of work function of a metal and high contact resistance. Here, we report the fabrication of Ohmic contacts by evaporation of indium (In) at a relatively low thermal energy onto molybdenum disulfide (MoS2), resulting in a van der Waals In MoS2 accumulation-type contact with a metal-induced electron doping density as ~10^12/cm^2. We show that the transport at the In/accumulation-type contact is dominated by the field-emission mechanism over a wide temperature range from 2.4 to 300 K and at a carrier density as low as ~10^12/cm^2 for a few-layered MoS2 device. In this case, the contact resistance reaches 0.6 kOhm um at cryogenic temperatures. These results pave a practically available path for fabricating Ohmic MoS2 contacts for high-performance electronic and optoelectronic applications.