Reliability Challenges in Fabrication of Flexible Hybrid Electronics for Human Performance Monitors: A System Level Study

Varun Soman,Yasser Khan, Madina Zabran,Mark Schadt, Paul Hart,Michael Shay,Frank Egitto,Konstantinos Papathomas,Natasha A. D. Yamamoto,Donggeon Han,Ana C. Arias,Kanad Ghose,Mark D. Poliks,James N. Turner

IEEE Transactions on Components, Packaging and Manufacturing Technology（2019）

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摘要

Flexible hybrid electronics (FTIE) interface rigid electronic components with flexible sensors, circuits, and substrates. This paper reports the reliability improvement of an FTIE human performance monitor (TIPM), designed to monitor electrocardiography (ECG) signals. The 50.8 mm × 50.8 mm TIPM is fabricated on Kapton TIN polyimide (PI) substrate with flexible gold (Au) ECG electrodes on one side ...

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关键词

Gold,Substrates,Sensors,Integrated circuit reliability,Stress,TV

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