Qualification and Integration Aspects of the DSSC Mega-Pixel X-Ray Imager

K. Hansen, H. Klar,P. Kalavakuru,C. Reckleben, A. Venzmer, E. Wustenhagen, R. Schappeit, O.-C. Zeides, F. Okrent,C. Wunderer, M. Lemke,H. Graafsma, I. Schlosser,M. Manghisoni,E. Riceputi,S. Aschauer,L. Struder,J. Soldat, M. Tangl,F. Erdinger,A. Kugel,P. Fischer, L. Andricek,J. Ninkovic, M. Turcato,M. Porro

IEEE Transactions on Nuclear Science（2019）

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摘要

The focal-plane module is the key component of the DEPFET sensor with signal compression (DSSC) mega-pixel X-ray imager and handles the data of 128 × 512 pixels. We report on assembly-related aspects, discuss the experimental investigation of bonding behavior of different adhesives, and present the metrology and electrical test results of the production. The module consists of two silicon (Si) sen...

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关键词

Cameras,Heating systems,Curing,X-ray imaging,Silicon,Bonding,Strain

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