Panel Warpage of Fan-Out Panel-Level Packaging Using RDL-First Technology

In this study, fan-out panel-level packaging (FO-PLP) technology using a redistribution layer (RDL) first approach is demonstrated using a large glass panel as a carrier (550 mm mm size). Finite-element analysis (FEA) is conducted to investigate process-dependent panel-level warpage with considering material selection of photo-dielectric, glass carrier and molding compound, structure design, and process optimization. Taguchi method is implemented to identify important parameters resulting in large panel warpage in each process and further parametric studies are also conducted with detailed FEA simulation. The effect of gravity on panel warpage has been simulated and analyzed in this study by considering the panel process and panel size. Modeling gravity effect reduces the panel warpage significantly, which is very close to the real case and is validated by warpage measurement results. Therefore, the gravity effect on warpage needs to be modeled for the large panel-warpage simulation to achieve accurate simulation results.