3D Heterogeneous Integration with 2D Materials

Connor McClellan,Connor Bailey,Isha Datye,Alexander Gabourie,Ryan Grady,Kirstin Schauble,Sam Vaziri,Eric Pop

2019 Silicon Nanoelectronics Workshop (SNW)（2019）

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摘要

As traditional device scaling slows down, three-dimensional (3D) integrated circuits (ICs) are needed to continue Moore's Law advancements. We show that two-dimensional (2D) semiconductors are promising for heterogeneously integrated 3D ICs owing to their atomically thin nature and unique processing, thermal, and device capabilities.

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关键词

two-dimensional semiconductors,device capabilities,2D materials,traditional device scaling,three-dimensional integrated circuits,Moore's law,2D semiconductors,heterogeneous integrated 3D ICs

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