Life Period Estimation of Stamping Process Using Punch Sounds and Deep Neural Network

Peng-Jen Chen, Tsung-Lun Wu,Tay-Jyi Lin,Ying-Hui Lai,Tsung-Liang Wu,Chingwei Yeh

conference on industrial electronics and applications（2019）

引用 4|浏览10

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摘要

This paper presents the life period estimation of stamping process by analyzing its punch sounds with a deep neural network (DNN). Neuro-approximated MFCC (NA-MFCC) feature extraction has also been proposed to trade estimation accuracy for computation complexity at a finer granularity. Several Pareto-optimal configurations have been reported with the performance measured on an ARM Cortex A15-based prototype.

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关键词

life period estimation,stamping process,punch sounds,deep neural network,neuro-approximated MFCC,NA-MFCC,feature extraction,finer granularity,Pareto-optimal configurations,ARM Cortex A15-based prototype,DNN,computation complexity

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