An air-plasma enhanced low-temperature wafer bonding method using high-concentration water glass adhesive layer
Applied Surface Science(2020)
摘要
•A non-toxic, inorganic adhesive material called water glass was investigated.•High-concentration adhesive layer was realized and then applied to wafer bonding.•Desirable and stable bonding strength was achieved.•Air-plasma treatment extend the bonding method to hydrophobic surfaces.
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关键词
Water glass,Air-plasma,Wafer bonding,Contact angle,Adhesive
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