Compact Scalable Dynamic TSV IR Drop Compensation for Power Delivery in 3D Packages.

Arjun Chaudhuri,Sukeshwar Kannan,Luke England, Jack Golz

IEEE Conference Proceedings（2019）

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摘要

We present a low-area, scalable compensation method for the IR drop appearing across a power through-silicon-via (TSV) in a 3D package. The proposed architecture provides real-time IR drop compensation of the top-die voltage supplied by the integrated voltage regulator (IVR) in the bottom die and has an area overhead of 0.053 mm 2 only.

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关键词

integrated voltage regulator,IR drop,compensation,3D IC

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