Numerical analysis on thermal crack initiation due to non-homogeneous solder coating on the round strip interconnection of photo-voltaic modules

•The Micro-Crack is initiated in the parallel direction with silver pad.•Non-Homogeneity direction decreases the Crack Initiation Temp (CIT) up to 21%.•By increasing the amount of molten solder/solder thickness, the CIT will decrease.•At high solder thickness the CIT Temp is less affected by Non-Homogeneity.•Increasing the IMC layer thickness leads to a decrease in the CIT.•Thinner IMC layers are more sensitive with Non-Homogeneity.