Evolution of Bimodal Microstructure and High-Temperature Wear Resistance of Al-Cu-Ni Alloys

We report excellent high-temperature (300 °C) wear resistance of copper mold-cast Al 80 Cu 15 Ni 5 and Al 75 Cu 15 Ni 10 alloys. The evolution of a novel bimodal microstructure consisting of α -Al, eutectic α -Al + Al 2 Cu, and a vacancy ordered phase (Al 3 Ni 2 type) restricts severe adhesive and abrasive wear at high temperature. Particularly, the Al 75 Cu 15 Ni 10 alloy shows a low wear rate at 300 °C. In-depth microstructural characterization of the as-cast alloys and the worn samples elucidate the wear mechanism.