4-Point-Bending Characterization of Interfacial Adhesion Strength of Co-Zr-Ta and Co-Zr-Ta Variant Thin-Film Stacks

2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA)(2019)

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摘要
In this study, soft magnetic thin films including Co-Zr-Ta (CZT) and its variant are deposited on TEOS SiO 2 and polyimide to characterize the interfacial adhesion strength of the full magnetic stack using the 4-Point-Bending (4PB) technique. Variation in critical load value Gc, an indicator of the interfacial adhesion strength, is observed. Auger Electron Spectroscopy (AES) is performed for elemental analysis to confirm the interface of de-lamination.
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关键词
Adhesion,CZT,4-Point-Bending
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