Research on Solder Joint Intermittent Fault Reproduction Based on Sweep Frequency Vibration Test

Aiming at the problem of solder joint intermittent fault reproduction, an intermittent fault reproduction method based on sweep frequency vibration test is proposed. Firstly, the dynamic model is constructed for intermittent fault mechanism analysis, and the environmental factors that affect intermittent faults are obtained. Then, sweep frequency vibration test is used to perform intermittent fault reproduction, and intermittent fault signals are obtained for intermittent fault detection.