Fiber Array Unit with Reduced Clad Fibers for High-Density Fiber-Chip Coupling

Scott R. Bickham, Wen-Lung Kuang,Ximao Feng

2019 IEEE CPMT Symposium Japan (ICSJ)（2019）

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摘要

We discuss the integration of G.657-compatible reduced-clad bend-insensitive (RCBI) fibers into two-dimensional fiber array units (FAUs) and into FAUs incorporating 90-degree bends to enable high-density and small form-factor fiber-chip connectivity solutions.

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关键词

fiber array,reduced-clad fiber,fiber-chip coupling,optical backplane component

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