Optoelectronic Glass Substrates for Co-packaging of Optics and ASICs

Lars Brusberg,Aramais R. Zakharian,S. Ekin Kocabas,Jason R. Grenier,Chad C. Terwilliger,Alan F. Evans

OFC（2020）

引用 2|浏览31

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摘要

A glass packaging substrate with integrated waveguides and evanescent couplers for silicon photonic chiplets is introduced for fiber to chip interconnects with high-channel counts required for co-packaging of optics and switch ASICs in next-generation datacenters.

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关键词

glass packaging substrate,integrated waveguides,evanescent couplers,silicon photonic chiplets,high-channel counts,switch ASIC,optoelectronic glass substrates,fiber-chip interconnects,datacenters

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