Test beam characterization of irradiated 3D pixel sensors

Due to the large expected instantaneous luminosity, the future HL-LHC upgrade sets strong requirements on the radiation hardness of the CMS detector Inner Tracker. Sensors based on 3D pixel technology, with its superior radiation tolerance, comply with these extreme conditions. A full study and characterization of pixelated 3D sensors fabricated by FBK is presented here. The sensors were bump-bonded to RD53A readout chips and measured at several CERN SPS test beams. Results on charge collection and efficiency, for both non-irradiated and irradiated up to 1016 n(eq)/cm(2) samples, are presented. Two main studies are described: in the first the behaviour of the sensor is qualified as a function of irradiation, while kept under identical conditions; in the second the response is measured under typical operating conditions.