Parametric study on the Void Risk in FC-POP Molded Underfill Process using a Novel Porous Media, Two-Phase, Compressible Flow Simulation Method

Molded underfill process provides many benefits for higher productivity and lower cost over the conventional capillary underfill process. However, the void defects in a molded underfill process could cause pop-corning effect and solder extrusion during the reflow process. This paper presents a highly efficient and accurate hybrid model that can be applied to diagnose the void risk in vacuum molded...