Long-lived modulation of plasmonic absorption by ballistic thermal injection

arxiv(2020)

引用 37|浏览25
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摘要
Light–matter interactions that induce charge and energy transfer across interfaces form the foundation for photocatalysis 1 , 2 , energy harvesting 3 and photodetection 4 , among other technologies. One of the most common mechanisms associated with these processes relies on carrier injection. However, the exact role of the energy transport associated with this hot-electron injection remains unclear. Plasmon-assisted photocatalytic efficiencies can improve when intermediate insulation layers are used to inhibit the charge transfer 5 , 6 or when off-resonance excitations are employed 7 , which suggests that additional energy transport and thermal effects could play an explicit role even if the charge transfer is inhibited 8 . This provides an additional interfacial mechanism for the catalytic and plasmonic enhancement at interfaces that moves beyond the traditionally assumed physical charge injection 9 – 12 . In this work, we report on a series of ultrafast plasmonic measurements that provide a direct measure of electronic distributions, both spatially and temporally, after the optical excitation of a metal/semiconductor heterostructure. We explicitly demonstrate that in cases of strong non-equilibrium, a novel energy transduction mechanism arises at the metal/semiconductor interface. We find that hot electrons in the metal contact transfer their energy to pre-existing free electrons in the semiconductor, without an equivalent spatiotemporal transfer of charge. Further, we demonstrate that this ballistic thermal injection mechanism can be utilized as a unique means to modulate plasmonic interactions. These experimental results are well-supported by both rigorous multilayer optical modelling and first-principle ab initio calculations.
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关键词
Electronic properties and materials,Nanophotonics and plasmonics,Nonlinear optics,Surfaces,interfaces and thin films,Ultrafast photonics,Materials Science,general,Nanotechnology,Nanotechnology and Microengineering
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