Multiple Chip Module Cooling Using Vapor Chamber

Abstract: This document describes the characterization of vapor chambers as cooling devices for multiple chip modules. The work consists of experiments and theory of vapor chambers. It includes developing and building the testing system, selecting the control and monitoring parameters, designing the vapor chamber, performing experiments, analyzing measurements, and drawing recommendations for vapor chamber selection and operation. The experiments include typical operation conditions found in electronics e.g. power dissipations up to 250 W, power densities up to 100 W/cm2, and operating temperatures up to 45 C among other parameters. The main outcome of this work is that vapor chamber performs better than a solid heat spreader under specific conditions and the guidelines are included in the conclusions section; other outcomes include correlations and quantification of vapor chamber thermal resistance functionality to the control parameters.