Advanced Self-Heating Model And Methodology For Layout Proximity Effect In Finfet Technology

2020 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS)(2020)

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摘要
Self-heating effect (SHE, Delta T-sh) has become a significant concern for device performance, variability and reliability co-optimization due to more confined layout geometry and lower-thermal-conductivity materials adopted in advanced technology, which substantially impacts on the integrated circuit (IC)'s design schemes. In this work, a new heat-dissipation-path based SHE model is proposed to describe the heat spreading to layout proximity by interactive thermal resistance (R-th(i,R-j)). Meanwhile, R-th-matrix methodology is employed to account for SHE layout proximity effect by linear superposition algorithm. Therefore, Delta T-sh profile can be more accurately reckoned with account for thermal interaction effect.
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关键词
Self-heating effect(SHE), FinFET, Layout Proximity, Heat spreading
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