Actively Aligned Flip-Chip Integration of InP to SiN Utilizing Optical Backscatter Reflectometry

Michael Theurer,Martin Moehrle,A. Sigmund,Karl-Otto Velthaus,Ruud M. Oldenbeuving,Lennart Wevers,F. M. Postma,Richard Mateman,Frederik Schreuder,Dimitri Geskus,Kerstin Worhoff,Ronald Dekker,Rene Heideman,Martin Schell

european conference on optical communication（2019）

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摘要

We present our hybrid III-V/SiN integration interface with a novel active alignment technique overcoming contacting limitations in flip-chip assembly. The interface allows for integration of single chips and full arrays. An average coupling loss of −2.1dB and a record coupled power exceeding 60mW is achieved.

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关键词

Hybrid integrated circuits,Flip-chip devices,Reflectometry,Silicon photonics,Semiconductor lasers

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