Influence of 2.09-μm pulse duration on through-silicon laser ablation of thin metal coatings

I Astrauskas,B. Povazay,A. Baltuska,A. Pugzlys

Optics & Laser Technology（2021）

引用 16|浏览3

暂无评分

摘要

•Few picosecond pulses are optimal for non-thermal ablation through silicon wafer.•Sub-microjoule 2.09-um pulse energies are sufficient for the metal lift-off.•Dispersion in Ho:YAG CPA can be controlled by a single volume Bragg grating.

查看译文

关键词

Laser material processing,Infrared lasers,Ultrafast lasers

AI 理解论文

溯源树

样例

生成溯源树，研究论文发展脉络

Chat Paper

正在生成论文摘要