Hydroquinone oriented growth control to achieve high-quality copper coating at high rate for electronics interconnection
Journal of the Taiwan Institute of Chemical Engineers(2020)
摘要
•High rate copper electrodeposition with high-quality coating was achieved through an additive system.•The possible mechanism of the proposed additive system was analyzed.•The proposed additive system improves uniformity of through holes which enhances its potential in practical application.
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关键词
high rate electrodeposition,copper interconnection,hydroquinone,copper nanocube,organic additive
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