Effects of cladding configuration and volume fraction of Cu on thermal diffusivity in mono and bundled Al/Cu clads fabricated through a rod drawing process

Materials Letters（2021）

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摘要

•Thermal diffusivity of Al/Cu clads was investigated.•The bundled Al/Cu clad exhibited a higher thermal diffusivity than the mono Al/Cu clad.•It was due to a decrease in thermal contact resistance and the phase lag.

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Aluminum,Copper,Clad,Laser flash technique,Interface

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