Exanode: Combined Integration Of Chiplets On Active Interposer With Bare Dice In A Multi-Chip-Module For Heterogeneous And Scalable High Performance Compute Nodes

In the context of high performance computing (HPC), energy efficiency and computing density are key for targeting exascale architectures. Close integration of chiplets, active interposer and field programmable gate arrays (FPGA) paves the way for dense, efficient and modular compute nodes. In this paper, we detail the ExaNoDe multi-chip-module (MCM) combining the integration of a substrate, an active interposer, some chiplets and bare dice. The reported MCM demonstrates that the multi-level integration flow enables tight integration of hardware accelerators in a heterogeneous HPC compute node.