Ruggedizing vibration sensitive components of electro-optical module using wideband dynamic absorber

In the modern design approach, the cold portion of Integrated Dewar-Detector-Cooler-Assembly (substrate, infrared focal plane array, cold shield and cold filter) is directly mounted upon the distal end of a cold finger of a cryogenic cooler with no mechanical contact with the warm Dewar shroud. This concept allows for essential reduction of parasitic (conductive) heat load. The penalty, however, is that resulting tip-mass cantilever is lightly damped and, therefore, prone to vibrational extremes typical of the modern battlefield. Without sufficient ruggedizing, vibration induced structural resonances may affect image quality and even may cause mechanical failures due to material fatigue. Use of additional front supports or thickening the cold finger walls results in increased parasitic conductive heat load, power consumption and mechanical complexity. The authors explore the concept of wideband dynamic absorber in application to ruggedizing the Integrated Dewar-Detector-Cooler Assembly.