Plating Thickness Evaluation With The Radial Basis Functions

Daigo Kosaka, Kazuhiko Kakishita,Takaaki Nara

INTERNATIONAL JOURNAL OF APPLIED ELECTROMAGNETICS AND MECHANICS(2020)

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摘要
The purpose of this work is to evaluate the thickness of the plating layer of vibrating samples using Eddy Current Testing (ECT). In almost previous research, the thickness is evaluated with the fixed liftoff, because the liftoff has an impact on detection signals of the ECT. In this paper, the plating thickness is evaluated in an environment in which the liftoff is greatly changed. A plating thickness evaluation with the Radial Basis Functions was proposed. The thickness of the test sample was evaluated while applying a vibration. It was confirmed that the evaluation result of the method, which uses detection signals in a wide range of liftoffs as calibration signals, was less affected by the liftoff change than the evaluation result of a method which uses phase of detection signals.
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关键词
Plating thickness, thin layer, thickness measurement, eddy current testing, radial basis function
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