Quantitative mechanisms behind the synchronous increase of strength and electrical conductivity of cold-drawing oxygen-free Cu wires

•Trade-off relation between strength and electrical conductivity of Cu wire was broken.•Strengthening mechanism and conducting mechanism were calculated quantitatively.•Grain boundary,<111>texture and dislocation are the main strengthening factors.•The elongated grains and dislocation recovery improve the electrical conductivity.•Thin-long grains simultaneously increase the strength and electrical conductivity.