Effects Of Gelatin On Electroplated Copper Through The Use Of A Modified-Hydrodynamic Electroplating Test Cell

We demonstrated the effects of gelatin in an electroplating bath on the morphology of electrodeposited copper through the use of a modified-hydrodynamic electroplating test cell (M-HETC). The proposed M-HETC is an electroplating test cell that provides a stable and reproducible flow field and controllable mass transfer. In addition, the M-HETC allows exploration of the variations in the surface appearance of electrodeposits over a wide range of current densities in a single electroplating test. Results indicate that this proposed time-efficient tool can be used to study the key factors that influence the surface morphology and properties of electrodeposited copper.