Femtosecond laser single step, full depth cutting of thick silicon sheets with low surface roughness

Zhaoqing Li,Olivier Allegre,Qianliang Li,Wei Guo,Lin Li

Optics & Laser Technology（2021）

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摘要

•Femtosecond laser through cutting of silicon sheets shows a surface roughness of 191 nm Ra.•P- and S-polarization have been compared. In both cases, the sidewall quality can be improved.•The effect of laser polishing of sidewall is discussed.

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关键词

Silicon wafer,Full depth cutting,Femtosecond laser,Parallel scan lines,Sidewall roughness,Polarization

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