High Quality Integrated Inductor in Fan-out Wafer-Level Packaging Technology for Mm-Wave Applications
2020 50TH EUROPEAN MICROWAVE CONFERENCE (EUMC)(2020)
摘要
In this paper, a multilayered integrated inductor in Fan-out Wafer Level Packaging (FoWLP) technology is investigated. The inductor is designed on polyimide for integration into the redistribution layer of the package. Excellent correlation is obtained between simulation and measurement results. The fabricated inductor has an inductance of approximately 480 pH and a quality factor of approximately 27 at 11 GHz.
更多查看译文
关键词
5G,mm-Wave,mobile communication,inductors,quality factor,inductance,polyimide,packaging,FoWLP,multilayer
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要