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Impact of Surface Recombination on Single-Event Charge Collection in an SOI Technology

IEEE transactions on nuclear science(2021)

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摘要
Semiconductor-insulator interfaces play an important role in the reliability of integrated devices; however, the impact of these interfaces on the physical mechanisms related to single-event effects has not been previously reported. We present experimental data that demonstrate that single-event charge collection can be impacted by changes in interface quality. The experimental data, combined with simulations, show that single-event response may depend on surface recombination at interface defects. The effect depends on strike location and increases with increasing linear energy transfer (LET). Surface recombination can affect single-event charge collection for interfaces with a surface recombination velocity (SRV) of 1000 cm/s and is a dominant charge collection mechanism with SRV >10 5 cm/s.
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关键词
Interface quality,microbeam,silicon-on-insulator (SOI),single-event effects,surface recombination
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