Portable Multi-Spectral Imaging: Devices, Vertical Integration, and Applications

2020 IEEE International Electron Devices Meeting (IEDM)(2020)

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摘要
Recent advances in semiconductor and packaging technologies have accelerated the miniaturization of portable sensing devices including visible-domain cameras, IR cameras, and millimeter-wave (mmWave) radars. Simultaneously, image and sensor data processing capabilities based on Systems-on-Chip (SoCs) have evolved as well to the extent toward the goal of implementing learning-based automatic recognition capabilities. This paper discusses the challenges and opportunities associated with the vertical sensors-to-software integration of portable systems capable of performing multi-spectral imaging, where data from different portions of the EM spectrum is captured, processed, and displayed simultaneously. An example hardware implementation, multi-spectral image data, and potential applications are discussed.
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关键词
portable sensing devices,visible-domain cameras,IR cameras,millimeter-wave radars,sensor data processing capabilities,systems-on-chip,automatic recognition capabilities,portable systems,hardware implementation,vertical integration,semiconductor technologies,packaging technologies,portable multispectral imaging data,sensor-to-software integration,SoC,EM spectrum,mmWave radars
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