Organic Package Substrates Using Lithographic Via Technology for RF to THz Applications

A. Aleksov,G. Dogiamis,T. Kamgaing,A. Elsherbini,J. Swan, K. Darmawikarta, S. Boyapati, J. Holloway, R. Han

2020 IEEE International Electron Devices Meeting (IEDM)（2020）

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摘要

RF substrate packages were built using organic dielectric layers with Copper (Cu) based interconnects employing lithographically defined vias as a new manufacturing paradigm for a semi-additive process flow. The package-based RF-to-THz structures enabled by lithographic vias in combination with advanced organic build-up dielectric materials have enabled us to demonstrate applications ranging from coaxial and coplanar waveguides, high-Q RF inductors and transformers to filters, triplexers and launcher structures for RF applications in the frequency range from 1 GHz to > 300 GHz. Measurement results for selected structures are presented and discussed in this paper.

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关键词

Copper based interconnects,manufacturing paradigm,semiadditive process flow,lithographic vias,advanced organic build-up dielectric materials,coaxial waveguides,coplanar waveguides,launcher structures,organic package substrates,RF substrate packages,organic dielectric layers,package-based RF-to-THz structures,high-Q RF inductors,Cu

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