Product Yield Enhancement by Spacer Thickness Variation Reduction

Ritesh Ray Chaudhuri,William Simpson,Daniel Fedor, Prabhakar Bharatan, Joseph Thompson, Farid Sellidj,John Lee,Michael Hurt,Glen Martin

2021 32nd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)（2021）

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摘要

Process variation significantly affects product quality and yield in scaled CMOS technologies. Managing process variation is a critical challenge in high volume high mix semiconductor manufacturing environment. This work describes different aspects of overall product yield improvement by reducing CMOS spacer thickness variation.

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关键词

CMOS technology,Product design,Manufacturing,Quality assessment,Yield estimation,Problem-solving

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