Active Silicon Chiplet-Based Interposer for Exascale High Performance Computing

Severine Cheramy,Pascal Vivet,Denis Dutoit,Fabien Clermidy,Jean Charbonnier,Perceval Coudrain, Emmanuel Ollier

2021 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA)（2021）

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摘要

With the era of massive multi-core architecture targeting cloud computing for exascale high performance computing (HPC) and big data applications, large scale multi-core are made possible thanks to advanced 3D integration technologies. This paper presents an innovative concept of active silicon interposer with stacked chiplets, with the objective of maintaining overall power consumption budget, in...

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