A facile solution-based metallisation method without harsh conditions and expensive activators for paper substrate and its application in flexible supercapacitor

Materials & Design(2021)

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摘要
•The solution-based Au/Ni-P metallisation of cellulose papers was realized.•Au/Ni-P composites offer high conductivity and mechanical stability.•Au/Ni-P metallisation of cellulose papers exhibit excellent flexibility.
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关键词
Metallisation,Paper substrate,Electroless plating processes,Supercapacitor
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