Foreword Special Issue on Low-Temperature Processing of Electronic Materials for Cutting Edge Devices

Paul R. Berger,Muhammad Mustafa Hussain,Francesca Iacopi,Jörg Schulze,Peide Ye,Willy Rachmady,Huang-Chun Wen,Siddharth Krishnan

IEEE Transactions on Electron Devices（2021）

引用 1|浏览6

暂无评分

摘要

Thermal budgets hinder leading-edge ultra-scaled and novel designs, and moving to reduced temperature processing is becoming an acute impediment globally.

查看译文

AI 理解论文

溯源树

样例

生成溯源树，研究论文发展脉络

Chat Paper

正在生成论文摘要