Comparison of Sample Preparation with Microsection and FIB Depending on the Detail of Structure

This article deals with the possibilities of representing the detail of solder ball inner structure more precisely using two methods of sample preparation. The first method of sample preparation is standard metallographic microsection with grinding and polishing with diamond paste with a grain size up to 0.25 μm. The second method is the microsection of the BGA (ball grid array) ball using FIB (fo...