A Novel Pin-fin Based Cooling Device for Autonomous Driving High-performance Computers

2021 Smart Systems Integration (SSI)(2021)

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摘要
in this study, a novel design for a liquid cooler is presented to control the temperature in high-performance processors. Experiments are performed to show the superior performance of the 3D metal printed cooler compared to existing fan heat sinks. A computational fluid dynamics model is additionally developed and validated in this study by experiments. The model is aimed at providing a low cost a...
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关键词
heat sink,high-performance processor,computational fluid dynamics
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