Machine Learning Approaches Optimizing Semiconductor Manufacturing Processes
2021 5TH IEEE ELECTRON DEVICES TECHNOLOGY & MANUFACTURING CONFERENCE (EDTM)(2021)
摘要
This study was geared toward the optimization of semiconductor manufacturing processes through machine learning (ML) based on a regression algorithm. The nonuniformity of plasma-enhanced atomic layer deposition (PEALD) film thickness and PEALD film stress and the film thickness and carbon etching profiles were demonstrated herein to successfully achieve their targets.
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关键词
Machine learning, plasma processing, materials informatics
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