Analysis and Comparison of Readout Architectures and Analog-to-Digital Converters for 3D-Stacked CMOS Image Sensors

This review paper presents an overview of readout architectures and analog-to-digital converters (ADCs) for 3D-stacked CMOS image sensors (CIS) with their advantages and challenges. Depending on the application requirements, a suitable 3D-stacked readout architecture will be proposed. While most ADCs to date have been reported in planar CIS, this paper ports these designs to a 3D-stacked CIS and c...