3-D Finite Element Modeling of Nanoindentation on Sn-3.5Ag Lead-Free Solder

2021 IEEE Regional Symposium on Micro and Nanoelectronics (RSM)（2021）

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摘要

The continuous search for richer and simpler characterization method leads to the use of 3-D finite element method to complement and visualize the Berkovich nano-indentation on the Sn3.5Ag solder as a mean to characterize their mechanical properties. This modelling-simulation study correlated with our earlier experimental nano-indentation study published elsewhere [1]. P-h curve extracted from phy...

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关键词

nanoindentation model,Sn-3.5Ag,lead-free solder,finite element method

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