Advanced Air Gap Formation Scheme Using Volatile Material

H. Warashina,H. Kawasaki,H. Nagai,T. Yamaguchi,N. Sato, Y. Kikuchi, X. Sun

2021 IEEE International Interconnect Technology Conference (IITC)（2021）

引用 4|浏览13

暂无评分

摘要

As a solution for RC delay of BEOL interconnect, we developed a novel air gap formation scheme. This scheme uses a volatile material (VM) and allows us to omit one lithography step, which was required for conventional air gap formation. It is possible to apply this scheme to subtractive interconnect scheme too. In this study, we will introduce the basic characteristics of VM and demonstrate the no...

查看译文

关键词

Conferences,Air gaps,Lithography,Capacitance,Delays

AI 理解论文

溯源树

样例

生成溯源树，研究论文发展脉络

Chat Paper

正在生成论文摘要