Impact of Micromachining Process on Cu-Sn Solid-Liquid Interdiffusion (SLID) Bonds

Hexin Xia,Avisek Roy,Eivind Bardalen,Hoang-Vu Nguyen,Knut Eilif Aasmundtveit,Per Ohlckers

2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)（2021）

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摘要

Copper-tin Solid-Liquid Interdiffusion (Cu-Sn SLID) bonding has shown potential for packaging of microelectromechanical system (MEMS) devices such as microbolometers due to its low cost and high-temperature stability. A thin micromachined silicon cap is desired in the packaging of microbolometers to minimize the infrared light absorption. In the preferred fabrication process flow, the Cu-Sn sealin...

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关键词

Microelectromechanical systems,Fabrication,Electrochemical deposition,Micromechanical devices,Adhesives,Metals,Micromachining

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