Development of innovative substrate and embedding technologies for high frequency applications

Dionysios Manessis,Stefan Kosmider,Lars Boettcher, Manuel Seckel,Kavin Murugesan,Uwe Maaß,Ivan Ndip,Andreas Ostmann,Rolf Aschenbrenner,Martin Schneider-Ramelow,K-D. Lang

2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)（2021）

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摘要

This paper brings into light all the new developmental work performed in the wide domain of high frequency PCBs for the realisation of innovative metasurfaces at 5GHz as well as compact highly integrated 5G antenna-in-modules at 40 GHz. There is a fast growing demand in high frequency market that justifies the intense R&D work also on microwave and especially mmWave technologies, comprising bo...

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关键词

Surface impedance,5G mobile communication,Surface resistance,Metasurfaces,Hardware,High frequency,Substrates

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