Ultra-broadband Integrated Capacitive Silicon Interposer assembled with SnBi Eutectic Solder
2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)(2021)
摘要
Low temperature solders usage for broadband assemblies represent an important challenge for the industry. Using lower temperatures for reflow subsequently shows less deformation on mother boards used for optical sub-assemblies and then less RF parasitics. However, some parts in optical sub-assemblies, like laser diodes, require good thermal dissipation to work properly and avoid unwanted modulatio...
更多查看译文
关键词
SnBi eutectic,Vertical integration,Ultra-broadband,Integrated Passive Devices,Silicon interposer
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要