The step curing method decided by curing kinetics equation and isothermal viscosity curve for electrical epoxy packaging materials

In this manuscript, the curing kinetics equation and isothermal viscosity curve were used to improve the step curing method for epoxy materials used in saturation reactor. The cure kinetic model and kinetic parameters of epoxy resin were studied by DSC. And the gelation time of epoxy resin was investigated by isothermal viscosity curve. Meanwhile, the settlement rate was characterized by comparing...