Comparative Study On The Properties And Microscopic Mechanism Of Ti Coating Andwcoating Diamond-Copper Composites

Interface plays a decisive role inmetal matrix composites, and the effects of Ti coating andW coating on the properties andmicroscopic mechanism of diamond-copper composites are compared in this paper. Ti-coated diamond with 50 nm, 100 nmand 150 nm plating thickness and W-coated diamond with 50 nmplating thickness are prepared by usingmagnetron sputtering. Then infiltration method is carried out to prepare diamond copper composites. SEM, EDS and XRD are used to material microstructure. Three-point bending experiment and flashmethod are used to test the bending strength and thermal conductivity of the composite material. The study found that, as the thickness of the Ti coating increases, the bending strength of the composites gradually increases, but the thermal conductivity first increases and then decreases. The thermal conductivity ofWcoated diamond copper composites is higher than that of Ti coated diamond copper composites with the same coating thickness. But bonding strength shows the opposite law. The reason for the above phenomenon is that themechanism of action between the Ti coating and theWcoating and the copper substrate is different at themicro interface of the composites. The research work has important reference value for the interfacemodification of diamond copper composites.