Bonding mechanism and electrochemical impedance of directly bonded liquid crystal polymer and copper

Taufique Z. Redhwan,Arif U. Alam,Yaser M. Haddara,Matiar M. R. Howlader

2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)（2017）

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摘要

We report direct bonding of liquid crystal polymer and copper film for electrochemical sensing for the first time. A peel strength of 683 g/cm was observed indicating strong adhesion. X-ray photoelectron and electrochemical impedance spectroscopies were used to characterize the sensing electrodes.

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关键词

sensing electrodes,electrochemical impedance spectroscopy,X-ray photoelectron spectroscopy,strong adhesion,peel strength,electrochemical sensing,copper film,directly bonded liquid crystal polymer,direct bonding mechanism,Cu

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