Generic Heterogeneously Integrated Iii-V Lasers-On-Chip With Metal Coated Etched-Mirror

SMART PHOTONIC AND OPTOELECTRONIC INTEGRATED CIRCUITS XVIII(2016)

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摘要
We demonstrate electrically-pumped III-V quantum-well lasers bonded on SiO2 with a metal-coated etched-mirror. The metal-coated etched-mirror allow the lasers to be used as on-chip laser, but our process design make sure that it requires no additional fabrication step to fabricate the metal-coated etched mirror. The bonded III-V on SiO2 also permits tight laser mode confinement in the active region due to high index contrast between III-V and SiO2. Moreover, it promises a flexible choice of host substrate, in which the silicon substrate could also be replaced with other materials. The laser devices demonstrated have the lowest threshold of 50 mA, a maximum output power of 9 mW and a differential quantum efficiency of 27.6%.
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Semiconductor laser,III-V laser on silicon,photonics integration
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